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Corporate Outline

Course List

* If the training you request is not in the list, please contact your nearest DISCO affiliate office or agent.
* Most Operation trainings are offered by DISCO affiliate office or agent.
* For training fees, please contact a DISCO affiliate office or agent for a quotation.

  • If you would like to learn the full set of operation skills, please attend both Operation 1 and Operation 2 of the new course composition.
  • Content may differ depending on the course. Please contact a DISCO affiliate office or agent for details.
  • Equipment with certain features/user-specifications may not be available at the Training Center. The trainer will give additional explanations verbally, without training materials.
  • We may not be able to conduct training for the content shown below.
    1. Customer special specifiation parts
    2. Maintenance tasks that can only be performed by a DISCO engineer
    3. Operation training using customer products

Dicing Saw / Laser Saw

*Course capacity ranges from 2 to 4 trainees depending on the equipment model and the course. Please contact us for details.

Operation 1 Operation 2 Maintenance 1 Maintenance 2
Course Objective To enable trainees to understand the terms necessary for operating the equipment and to process products by calling up data sets in the equipment To enable trainees to create and set data, and to set up the functions for operating the equipment To enable trainees to precisely and safely perform periodic maintenance and replacement of consumable parts as described in the Maintenance Manual of the equipment To enable trainees to conduct maintenance tasks which are not described in the Maintenance Manual of the equipment (only items that can be executed without the use of any special tools or access to internal maker data)
Main Course Topics
*Topics may differ depending on the equipment type 		・Equipment Overview
・Important Safety Information
・Equipment Start-up and Termination
・Workpiece Cutting 		・Manage and Edit Device Data
・Alignment Teach
・Blade Replacement…Only for Dicing Saws 		・Inspection Items
・Greasing
・Consumable Part Replacement
・Backing Up Machine Data
・Wheel Mount/Flange Conditioning…Only for Dicing Saws 		・Equipment Structure (Electrical Components, Safety Interlock Circuits)
・Equipment Part Replacement
・Accuracy Inspection…Only for applicable Dicing Saws
DAD3220
DAD3230
DAD3350
DAD3430 		1day 1.5day 2days 2days
1.5day
(Measurement Alignment Package)
DAD3650 1day 1.5day 2days -
1.5day
(Measurement Alignment Package)
DFD6340
DFD6341 		1day 2days 2days 2days
2days
(Measurement Alignment Package)
DFD6361
DFD6360
DFD6362 		1day 2days 2days 2days
2days
(Measurement Alignment Package)
1day
(Half-cut Specification) 		2days
(Half-cut Specification) 		3days
(Half-cut Specification) 		3days
(Half-cut Specification)
DFD6560 1day 2days 2days 2days
DFD6750 1day 2days 2days 3days
DFL7160 1day 1day 2days 1day
DFL7161 1day 1day 2days 1.5days
1day
(BSS6 Specification) 		3.5days
(BSS6 Specification)
DFL7361
DFL7362 		1day 1day 2days -

Grinder

*Course capacity ranges from 2 to 4 trainees depending on the equipment model and the course. Please contact us for details.

Operation 1 Operation 2 Maintenance 1 Maintenance 2
Course Objective To enable trainees to understand the terms necessary for operating the equipment and to process products by calling up data sets in the equipment To enable trainees to create and set data, and to set up the functions for operating the equipment To enable trainees to precisely and safely perform periodic maintenance and replacement of consumable parts as described in the Maintenance Manual of the equipment To enable trainees to conduct maintenance tasks which are not described in the Maintenance Manual of the equipment (only items that can be executed without the use of any special tools or access to internal maker data)
Main Course Topics
*Topics may differ depending on the equipment type 		・Equipment Overview
・Important Safety Information
・Initialization
・Warmup
・Workpiece Grinding 		・Managing and Editing Recipe Data
・Wheel Replacement
・Setup Procedures
・Dressing 		・Inspection Items
・Greasing
・Consumable Part Replacement
・File Management and Log Data 		・Self Grinding
・Adjustment (Transfer, Robot etc.)
・Equipment Structure (Piping, Electrical Components)
DFG8540 1day 1day 1.5days 3days
DGP8760 1day 1.5days 1.5days 3days
DGP8761 1day 1.5days 1.5days 3.5days

Mounter / Die Separator

*Course capacity ranges from 2 to 4 trainees depending on the equipment model and the course. Please contact us for details.

Operation 1 Operation 2 Maintenance 1 Maintenance 2
Course Objective To enable trainees to understand the terms necessary for operating the equipment and to process products by calling up data sets in the equipment To enable trainees to create and set data, and to set up the functions for operating the equipment To enable trainees to precisely and safely perform periodic maintenance and replacement of consumable parts as described in the Maintenance Manual of the equipment To enable trainees to conduct maintenance tasks which are not described in the Maintenance Manual of the equipment (only items that can be executed without the use of any special tools or access to internal maker data)
DFM2800 0.5days 1day 1.5days 3days
DDS2300 1day 1day 2days -

Option

Option

* The courses are available only for those who take Operation, Maintenance 1, Maintenance 2 or Tier 1 - 3 courses. (Regardless to the type of equipment)
* Applications for the optional courses alone will not be accepted.
* The end time on the first day of the training will change according to the hours needed for the optional course.
Please contact us for any inconveniences.

Kiru, Kezuru, Migaku Solutions Training

Solutions

Process Introduction by Device

Latest Processing Technologies in Wafer Level Package Manufacturing
  • 2.5hours

    The wafer level packaging (WLP) manufacturing process is gradually recapturing attention in recent years. In this seminar, we introduce the latest Kiru, Kezuru, and Migaku processing technologies in the WLP manufacturing process, and discuss the latest topics, from basic technologies, to warpage countermeasures for wafer thinning and challenges in Low-k processing.

Latest Thinning Technologies in Memory Production
  • 1hour

    In this seminar, we introduce the latest processing technologies in memory production, focusing on the NAND thinning process, which drives the wafer ultra-thinning market, and discuss the latest topics, from basic technologies, to the DBG and SDBG processes used in mass production.

Latest Thinning Technologies in Power Device Manufacturing
  • 1hour

    Power devices are widely used in diversified equipment and are also becoming popular in saving energy and reducing CO2 emissions. In this seminar, we introduce the latest processing technologies in power device manufacturing, and discuss the latest topics, from basic market information, to SiC power devices.

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