This webpage contains technical reviews and articles on Kiru, Kezuru, and Migaku technologies.

• 2025/1/20

  Governing Factors of Processing Quality for the Silicon Wafer Thinning Process (TR24-01)

• 2024/2/13

  Fully automated quality management after singulation for reliable failure prediction (TR23-03)

• 2023/5/15

  StayClean Anti-Particle and Anti-Corrosion Effects on Electrode Pads (TR23-02)

• 2023/5/15

  Die Strength After Ultrashort Pulse Laser Processing (TR23-01)

• 2022/3/17

  Highly purified water-soluble protective film for semiconductor processes (TR21-02)

• 2021/9/6

  Resistivity Control of Cutting Water with CO₂ Injector and Hub Blade Wear (TR21-01)

• 2019/1/11

  Investigation of Cu and Ni Diffusion Amounts for Silicon Substrates (TR18-02)

• 2019/1/11

  Investigation of particles in the dicing saw usage environment (TR18-01)

• 2016/6/10

  Definition of Class 1 required for laser equipment and its importance (TR16-10)

• 2016/6/10

  The effects of edge trimming (TR16-09)

• 2016/6/10

  Usefulness of the ultra-compact deionized water recycling unit for dicing saws (TR16-07)

• 2016/6/10

  Wafer ultra-thinning process for 3D stacked devices and the influences on the device characteristics (TR16-06)

• 2016/6/10

  Dicing technologies for SiC (TR16-05)

• 2016/6/10

  Stealth laser dicing engine lineup (TR16-04)

• 2016/6/10

  Silicon wafer thinning, the singulation process, and die strength (TR16-03)

• 2016/6/10

  Wafer ESD in dicing saws and the effect of the countermeasure (TR16-02)

• 2016/6/10

  Thermal effect of stealth laser dicing (TR16-01)